International Program Committee

• F. Belli – University of Paderborn, Germany
• I. Bluemke – Warsaw University of Technology, Inst. of Comp. Sc, Poland
• M. Boasson – University of Amsterdam (retired), Netherlands
• J. Boaventura – University of Tras-os-Montes and Alto Douro, Portugal
• C. Bunse – Stralsund University of Applied Sciences, Germany
• M. Burgin – UCLA, USA
• D. Caivano – University of Bari, Italy
• S. K. Chen – IBM, USA
• P. J. Clarke – Florida International University, USA
• J. J. Cuadrado-Gallego – University of Alcala, Spain
• J. Dong – University of Texas, Dallas, USA
• P. Dugerdil – HEG - University of Applied Sciences, Switzerland
• A. Eberlein – American University of Sharjah, United Arab Emirates
• H. D. Ehrich – Braunschweig University of Technology, Germany
• Y. Eterovic – Pontificia Universidad Católica de Chile, Chile
• L. Etzkorn – University of Alabama in Huntsville, USA
• F. Fabbrini – ISTI-CNR, Italy
• B. H. Far – University of Calgary, Canada
• M. Felici – University of Edinburgh, United Kingdom
• A. Folleco – Florida Atlantic University, USA
• R. Fox – Northern Kentucky University, USA
• A. Fraga – Carlos III University of Madrid, Spain
• K. Gary – Arizona State University, USA
• S. Gokhale – University of Connecticut, USA
• W. Golubski – West Saxon University of Applied Sciences Zwickau, Germany
• K. Gondow – Tokyo Institute of Technology, Japan
• C. Gresse von Wangenheim – Federal University of Santa Catarina, Brazil
• J. Guo – California State University Los Angeles, USA
• R. Hewett – Texas Tech University, USA
• S. Huang – Florida Atlantic University, USA
• G. Ježic – University of Zagreb, Croatia
• R. Juric – University of Westminster, United Kingdom
• P. Kokol – University of Maribor, Slovenia
• P. Krishnan – Bond University , Australia
• T. Larsson – Halmstad University, Sweden
• S. W. Lee – University of North Carolina at Charlotte, USA
• Y. Lei – University of Texas at Arlington, USA
• H. Leung – Hong Kong Polytechnic University, China PR
• S. Liang – Yootech Associates, USA
• L. Lundberg – Blekinge Institute of Technology, Sweden
• J. C. Maldonado – University of Sao Paulo, Brazil
• C. Mancas – Ovidius University, Romania
• A. Mili – New Jersey Institute of Technology, USA
• T. Müldner – Acadia University, Canada
• M. Munro – Durham University, United Kingdom
• J. Navón – Catholic Pontifical University of Chile, Chile
• T. Panas – Lawrence Livermore National Laboratory, USA
• J. Peng – Chongqing University of Science and Technology, China PR
• P. Petrov – Emerand AD, Bulgaria
• M. Pizka – Itestra GmbH, Germany
• M. Reformat – University of Alberta, Canada
• W. Retschitzegger – Johannes Kepler University of Linz, Austria
• D. Rodríguez – University of Alcalá, Spain
• M. Sadjadi – Florida International University, USA
• A. B. Salem – Ain Shams University, Egypt
• T. Seifert – Iteratec GmbH, Germany
• J. Seliya – University of Michigan-Dearborn, USA
• M. Shin – Texas Tech University, USA
• S. Takada – Keio University, Japan
• Y. Tao – Grand Valley State University, USA
• C. Tjortjis – University of Ioannina & University of Western Macedonia, Greece
• A. Toptsis – York University, Canada
• E. Tovar – Polytechnic University of Madrid, Spain
• M. Van Hilst – Florida Atlantic University, USA
• M. Vidakovic – University of Novi Sad, Serbia
• P. Vilela – Methodist University of Piracicaba, Brazil
• H. Xu – University of Massachusetts - Dartmouth, USA
• S. Xu – Algoma University, Canada
• Z. Xu – University of Michigan-Dearborn, USA
• W. Yang – National Chiao Tung University, Taiwan
• R. Zalila-Wenkstern – University of Texas, Dallas, USA
• C. Zhang – California State University - Sacramento, USA
• D. Zhang – California State University - Sacramento, USA

Additional Paper Reviewers

• T. Baba – Utsunomiya University, Japan
• S. Chaumette – LaBRI, University Bordeaux 1, France
• S. Ferretti – University of Bologna, Italy
• G. A. Gravvanis – Democritus University of Thrace, Greece
• J. Hall – The Open University, United Kingdom
• M. Qiu – University of Kentucky, USA
• J. Sauer – University of Oldenburg, Germany
• J. Wang – Bethune-Cookman University, USA