The Third IASTED African Conference on
Modelling and Simulation
AfricaMS 2010
Science and Technology Applications for Health and Sustainable Development
September 6 – 8, 2010
Gaborone, Botswana
INVITED SPEAKER
Next-Generation Wireless Communications Networks - From Chips to Architecture
Abstract
The present state of new, more-capable wireless communications networks bears a strong resemblance to the old proverb, "Much thunder, little rain." While there has been a great deal of talk, there has been little progress - as various technologies (such as "ultra-wideband" (UWB)) have failed completely, while others have spectacularly underachieved for a variety of reasons (such the inability to increase bandwidth without increasing power consumption). Clearly, a new start is required on this important and critical problem.This presentation will examine some new ideas in the development of next-generation wireless networks. Conventional thinking has become stultified because it tries to attack one specific problem at a time; here we note that much wider thinking (in both breadth and depth) is required. The entirety of new, unified approaches to the challenges is considered - from the use of semiconductor technology all the way up through new network architectures.
Biography of the Invited Speaker
Dr. Foty is also an Adjunct Professor of Electrical Engineering at the Georgia Institute of Technology (“Georgia Tech”), and is an advisor to the Tallinn University of Technology (Estonia), the University of Pretoria (South Africa), and the Tshwane University of Technology (South Africa). He is the author of the best selling book, MOSFET Modeling with SPICE: Principles and Practice, which was published in 1997 by Prentice-Hall and is now in its third printing; a Vietnamese language edition was published in early 2006. In addition, he has authored or co-authored some 100 journal articles and conference presentations, and is a frequent plenary (keynote) speaker at major international conferences throughout the world.
Dr. Foty holds the B.S. degrees in Physics and Chemistry from Bates College, the M.S. degree in Electrical Engineering from the University of Illinois, and the Ph.D. degree in Materials Science from the University of Vermont.